三磨/ZZSM 品牌
生产厂家厂商性质
所在地
SF系列伺服超高压油泵SF Series of Servo Ultra High Pressure Oil Pump
面议WZ系列往复增压器WZ Series of reciprocating type supercharger
面议六面顶压机液压站Hydraulic Stationof Cubic press
面议LDK-II 型电控柜LDK-II type Electrical Control System Product
面议超硬磨料滚镀机Barrel-plating Machines for Superhard Abrasives
面议超硬材料抗压强度测定仪Compressive Strength Testers for Single Particle
面议超硬材料冲击韧性测定仪Impact Toughness Testers for Superhard Abrasives
面议系列金刚石磁选机Diamond Magnetic Separators
面议磁化率分析仪Magnetic Susceptibility Analyzers
面议TD 系列三维涡流混料机TD Series 3D Blenders
面议SPS烧结压机系列SPS Sintering presses
面议普通双体炉系列Regular 2-Chamber Press Furnaces
面议减薄砂轮主要应用于半导体晶圆的减薄与精研加工。我公司生产的减薄砂轮可替代进口产品,在日本、德国、美国、韩国及国产磨床上稳定使用,砂轮磨削性能*,性价比高。
Back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
加工对象:分立器件、集成电路衬底及原始晶片等。
工件材料:单晶硅、砷化镓、磷化铟、碳化硅等半导体材料。
应用工序:背面减薄、正面磨削的粗磨加工和精研加工。
Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Applications: back thinning, rough grinding and fine grinding.