曲面研磨抛光机型号YH2M81118?主要特点 Technical characters

1.   该设备为八工位Lower plate真空吸附抛光机。工作时，将工件放置在工件盘治具上，利用真空吸附将工件固定在治具上，毛刷盘固定在上盘面，下上盘逆向旋转，抛光液由喷液管均匀流到Lower plate，利用毛刷、抛光液与玻璃之间的摩擦力实现对玻璃弧面的抛光，其抛光工作流程为：设备就绪-工件盘定位-自动上料-工位盘定位-抛光-完成一次抛光-工位盘定位-自清洁-自动下料-循环(其中，自动上下料-工位盘定位-自清洁与抛光制程可实现不停机循环进行)。

This machine is characterized with 8-station lower plate vacuum absorption polishing machine.Put workpiece on carrier jig, and the workpiece will be fixed on jig by vacuum absorption. The brush plate is fixed on upper plate,which reversely rotates with lower plate,with polishing liquid evenly flowing into the lower plate through spray pipe,making use of the friction between brush,polishing liquid and glass to polish glass camber surface. Polishing process:Machine ready - workpiece plate positioning - auto loading - work station plate positioning - polishing - first time polishing finished - self cleaning - auto unloading - circulation(auto loading/unloading-work station plate positioning - self cleaning and polishing can be proceeded in cycle without stop).

2.  本机下上盘均由数控程序精准定位控制，按工艺要求实现无极调速，以满足不同抛光工艺要求。八个工件盘由伺服电机控制，实现精准定位。

This machine upper&lower plates’ position are precisely controlled by CNC program, stepless speed governing is realized according to technological requirements,in order to meet different polishing process requirements.8 workpiece plates are controlled by servo-motor with precise positioning。The upper plate is independently driven by variable speed motor.

3.抛光盘的加压由伺服电机驱动滚珠丝杠在直线导轨上进行位移，精确控制抛光盘上下位移，来保持压力稳定，确保抛光精度。

4.  本机所有能接触到抛光液的液槽、箱体面板、接液盆，均采用不锈钢或铝合金等耐腐蚀材质。

Anti-corrosion materials such as stainless steel or aluminum alloy are adopted for this machine’s flume,panel,basin which are in contact with polishing liquid.

5.  设备真空系统配置有数显真空压力表，实时监控负压，以防欠压掉片。

Machine vacuum system is equipped with digital vacuum pressure gauge,real-time monitoring negative pressure,in order to prevent work piece from falling down if pressure is not enough.

6.  设备配置真空气液分离装置，自动排液；

Machine is equipped with vacuum air&liquid separating device for automatic draining.

7.  本机采用人机界面HMI(15寸大触摸屏)与可编程控制PLC相结合，操作方便快捷，界面友好，信息量大。

This machine adopts HMI(15Inch touch screen)with PLC,operation is convenient and efficient with friendly interface and huge amount of information.

项目Item

产品型号Model

单位

Unit

YH2M81118

Lower plate尺寸（外径×厚度）

Lower plate size(OD×Thickness)

mm

φ400mm×25mm（铝合金）

φ400mm×25mm(Aluminum alloy)

上盘尺寸（外径）

Upper plate size(OD)

mm

φ1160mm

抛光头数量

Number of polishing head

个

8

Lower plate转速

Lower plate speed

rpm

2～45±2 rpm

上盘转速

Upper plate speed

rpm

5～90±2 rpm

Z轴快移速度 Z axis movement speed

min

0~2.5m/min

Z轴行程 Z axis travel

mm

350mm

机床外形尺寸（长×宽×高）

Overall dimensions(L*W*H)

mm

2430*1935*2575mm

整机重量

Total weight

Kg

4050Kg