品牌
生产厂家厂商性质
所在地
槽磨用超硬材料砂轮Superhard Materials Grinding Wheels for Slot
面议
高精度成形磨削用金刚石修整滚轮Diamond Dressing Rollers for High Precision Form Grinding
面议
珩磨油石Honing Sticks
面议
凸轮轴、曲轴磨削用电镀CBN 砂轮Electroplated bond CBN Grinding Wheels for Camshaft and Crankshaft
面议
铣磨砂轮Diamond Milling Grinding Wheels
面议
金属结合剂整体型切割砂轮Metal Bond High Precision Dicing Blades Without Steel Core
面议
树脂结合剂整体型切割砂轮Resin Bond Dicing Blades Without Steel Core
面议
金刚石研磨液Diamond Slurry
面议
纳米二氧化硅抛光液Nano-Silica Slurry
面议
LED 背减薄砂轮Grinding Wheels for LED Substrate
面议
磨陶瓷插芯砂轮
面议
太阳能光伏行业用砂轮Grinding Wheels for Photovoltaic Industry
面议设备用途及性能特点
用于树脂及陶瓷结合剂固结磨具磨削层、排屑层的加工。
主要技术指标
●切槽深度：0～100mm
切槽宽度：2～10mm
●切槽形状：根据客户要求定制
Usages and performance characteristics
Used for the processing of grinding layer and dust removal layer of resin and vitrified bond abrasives.
Main technical indicators
● Groove depth：0 ～ 100mm; Groove width：2 ～ 10mm
● Groove shape：customized according to customer requirements
