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10w红外皮秒光纤激光器GS-PIR10系列(MiniLED)
10w Infrared Picosecond Fiber Laser GS-PIR10 Series
应用优势：单/双头输出、晶圆I R良率高、12um窄切割道
Advantages:
Single/Double head output,
LED wafer dicing, High I R yield,
12um narrow street width
技术指标：<15皮秒, 10瓦, 50kHz-200kHz
Specifications:<15ps, 10w, 50KHz-200KHz
主要应用：Mini-LED、硅、碳化硅等脆性材料切割
Applications: Mini-LED Saphire, Si, Sic and so on brittle materail cutting
Mini LED划片
Wafer dicing/LED sapphire dicin
参数 Parameters | 单位 Unit | GS-PIR10D |
工作模式 (Working Mode) | 脉冲 (Pulse) | |
中心波长 (Center Wavelength) | nm | 1027-1040 |
输出功率 (Max Optical Average Power) | W | 10 |
典型输出功率 (Typical Output Power) | W | 10@100KHz |
脉冲宽度 (Pulse Width) | ps | <15 |
输出脉冲个数 (Pulse Number) | 1-10 | |
重复频率 (Pulse Repetition Rate) | KHz | 50-200 |
偏振 (Polarization) | 线偏 (linear) | |
消光比 (Extinction Ratio) | dB | ＞ 20 |
脉冲串能量 (Max Pulse train Energy) | uJ | 30 |
光束质量M2(Beam Quality M2) | ≤1.2 | |
输出光斑直径 (Collimated Beam Diameter) | mm | 1.±0.3 |
输出光功率可调范围 (Output Power Tunability) | % | 0-100 |
功率稳定度 (Power Consumption) | % | <1 |
传递光纤长度 (Delivering Fiber Length) | m | 1 |
工作环境 Working Conditions | ||
功率消耗 (Power Consumption) | W | 240 |
工作电压 (Electrical Supply Voltage) | VDC | 24 |
工作温度 (Operating Temperature) | °C | 20to30 |
存储温度 (Storage Temperature) | °C | 0to50 |
体积 (Dimensions)(LxWxH) | mm | 612x430x223 |
重量 (Weight) | kg | 45 |
*本产品可以根据客户要求定制* Above specifications can be customizedfor your specific application.
机械结构MechanicalDimensions
